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Symetrix has been working closely with its MOCVD tool development partners and has been very successful in developing a mass production worthy
MOCVD tool for SBT ferroelectric deposition.
MOCVD is widely considered as an enabling technology for 3D stack cell architectures.
In this regard, Symetrix along with its tool development partners has been successful
in demonstrating thickness and stoichiometric conformal SBT deposition in deep
aspect ratio trenches suitable for very high density NVM applications. Moreover,
the deposited films can be crystallized with a Reduced Thermal Budget (RTB) process
that is purely Rapid Thermal Anneal (RTA) based and eliminates furnace anneals
completely. XRD patterns indicate enhanced polar axis orientation thereby resulting
in 2Pr values well in excess of 20uC/sq.cm with excellent reliability characteristics.
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